Direct-Copper-Bonded Alumina Substrates
Features:
  • 0.25-1mm thick ceramic with 0,3mm copper bonded on both sides with Optional Nickel plating
  • DCB thermal expansion matches silicon

  • Optimized for use in power hybrids
  • Excellent Mechanical Strength, Stable Shape with Good Adhesion & Corrosion Resistance
  • Good Thermal Conductivity
  • Very Good Thermal Cycling Capability
  • Good Heat Spreading, leaving no hot spots
  • Can be Structured like PCB or ‘IMS Substrate’
  • Basis for “Chip-on-board” technology
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